Thick-SOI photonics for sensing and imaging
VTT Technical Research Centre of Finland
PhotonHub Demo centre
English
16. 2. 2022
Silicon-based photonic integrated circuits
Mobility & energy Digital infrastructure Agro & food Manufacturing Safety, security, space & defence Health

Photonic integrated circuits (PICs) can be realized on many different technology platforms and used for numerous different applications. This course focuses on the so-called Thick-SOI platform and its use for sensing and imaging applications in the near and mid-infrared region. Primary focus is on 3 µm thick silicon-on-insulator (SOI) waveguide technology, since this 3 µm SOI platform has offered open-access multi-project wafer (MPW) runs via ePIXfab and VTT for several years. This platform is also available for small-to-large volume contract manufacturing via VTT and Rockley Photonics. Process design kits are available in multiple PIC design software platforms.

This one-day hands-on training course provides industry an overview of the Thick-SOI PIC platform and its feasibility in sensing and imaging applications. A clean room tour in Micronova offers an overview of the used fabrication methods and facilities. Hands-on training includes 1) the design of 3 µm SOI PICs using PIC design software, 2) wafer-level testing (WLT) in the clean room and 3) PIC testing in the photonics measurement lab. The last part includes semi-automated fiber-to-waveguide alignment, optical beam steering with an optical phased array (OPA) and one sensing demonstration that vary from training to training and may include e.g. Faraday rotation in SOI waveguides or gas sensing with a tunable light source.

  • Understanding the technical advantages and limitations of Thick-SOI PIC technology, as well as its key applications
  • Learn how the Thick-SOI PICs are designed & simulated (hands-on activity)
  • See the fabrication process of 3 µm SOI PICs (visit to the clean room)
  • Learn how the Thick-SOI PICs are tested at wafer and chip-level (hands-on activity)
  • See demonstrations of 3 µm SOI PICs in sensing and imaging applications (hands-on activity)
No experience Medium experience Advanced experience
It is desirable but not essential that course attendees have a basic understanding of photonics. The course is ideally suited to those planning to develop new photonic products based on low-loss photonic integrated circuits (PICs) operating within the 1.2-6 µm wavelength range where the thick (µm-scale) silicon-on-insulator (SOI) waveguides can operate.
VTT (Otaniemi)
Espoo
Finland
250 EUR
Coffee breaks, lunch, training consumables, training materials
10 persons
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