Photonic integrated circuits (PICs) can be realized on many different technology platforms and used for numerous different applications. This course focuses on the so-called Thick-SOI platform and its use for sensing and imaging applications in the near and mid-infrared region. Primary focus is on 3 µm thick silicon-on-insulator (SOI) waveguide technology, since this 3 µm SOI platform has offered open-access multi-project wafer (MPW) runs via ePIXfab and VTT for several years. This platform is also available for small-to-large volume contract manufacturing via VTT and Rockley Photonics. Process design kits are available in multiple PIC design software platforms.

This one-day hands-on training course provides industry an overview of the Thick-SOI PIC platform and its feasibility in sensing and imaging applications. A clean room tour in Micronova offers an overview of the used fabrication methods and facilities. Hands-on training includes 1) the design of 3 µm SOI PICs using PIC design software, 2) wafer-level testing (WLT) in the clean room and 3) PIC testing in the photonics measurement lab. The last part includes semi-automated fiber-to-waveguide alignment, optical beam steering with an optical phased array (OPA) and one sensing demonstration that vary from training to training and may include e.g. Faraday rotation in SOI waveguides or gas sensing with a tunable light source.

Registration link to August training:
https://www.lyyti.fi/reg/PhotonHub_Demo_centre_Aug2022

August training is directly after the 4th China-Europe Silicon Photonics Symposium and Course in the same location:
https://epixfab.eu/trainings/upcoming-trainings/4th-china-europe-silicon-photonics-symposium-and-course/