Thick-SOI photonics for sensing and imaging
VTT Technical Research Centre of Finland
PhotonHub Demo centre
1 day
Silicon-based photonic integrated circuits
Mobility & energy Digital infrastructure Agro & food Manufacturing Safety, security, space & defence Health

Photonic integrated circuits (PICs) can be realized on many different technology platforms and used for numerous different applications. This course focuses on the so-called Thick-SOI platform and its use for sensing and imaging applications in the near and mid-infrared region. Primary focus is on 3 µm thick silicon-on-insulator (SOI) waveguide technology, which is the most mature PIC technology platform at VTT. This platform is also available for small-to-medium volume contract manufacturing via VTT and there is a path to large-volume manufacturing via VTT's partners. Process design kits (PDKs) are available in multiple PIC design software platforms. An open-source version of the passive component PDK is available in Gdsfactory:

This one-day hands-on training course provides industry an overview of the Thick-SOI PIC platform and its feasibility in sensing and imaging applications. A clean room tour in Micronova offers an overview of the used fabrication methods and facilities. Hands-on training includes 1) the design of 3 µm SOI PICs using PIC design software, 2) General cleanroom visit and introduction to state-of-the-art manufacturing tools, and 3) PIC testing in the photonics measurement lab. The last part includes semi-automated fiber-to-waveguide alignment, optical beam steering with an optical phased array (OPA) and testing of other silicon photonic chips, such as external cavity lasers. The exact content of the hands-on training varies a bit for each training. It is not possible to attend the training online.

More details about the training, such as its schedule, trainers, location etc., can be found from the training details slide set (see separate link on this page). 

Registration link to May 2024 trainings (2 alternative days):

  • Understanding the technical advantages and limitations of Thick-SOI PIC technology, as well as its key applications
  • Learn how the Thick-SOI PICs are designed & simulated (hands-on activity)
  • See the fabrication process of 3 µm SOI PICs (visit to the clean room)
  • Learn how the Thick-SOI PICs are tested (hands-on activity)
  • See demonstrations of 3 µm SOI PICs in sensing and imaging applications (hands-on activity)
No experience Medium experience Advanced experience
It is desirable but not essential that course attendees have a basic understanding of photonics. The course is ideally suited to those planning to develop new photonic products based on low-loss photonic integrated circuits (PICs) operating within the 1.2-6 µm wavelength range where the thick (µm-scale) silicon-on-insulator (SOI) waveguides can operate.
Tour in the clean room with a demo for automated wafer-level testing
Hands-on training for coupling light from fibers to waveguides
Hands-on training for optical beam steering
VTT (Otaniemi)
Micronova, Tietotie 3, Espoo
100 EUR early bird until 15th April, 200 EUR normal
Coffee breaks, lunch, training consumables, training materials
10 persons
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