Photonic device packaging can account for over 50% of the photonic product manufacturing cost. Therefore, it is vital that industries developing photonic-based products have an understanding of the materials, technologies and processes required to package their photonic devices.
This 3-day training course provides industry, especially those involved in photonic product development, with the fundamental technical skills in package design, assembly and reliability analysis. The course covers the key optical, electrical, thermal and mechanical aspects of packaging technologies. It also provides an overview of packaging equipment and reliability factors which are critical parts of the total manufacturing ecosystem.
This unique industry ‘hands-on’ training programme provides attendees with access to state-of-the-art facilities, materials and equipment, with dedicated tutorials and mentoring for technical experts.